برگزاری وبینار تخصصی الکترونیک قدرت

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Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates

در تاریخ 23 July-2020 برگزار می ­شود. برای ثبت نام به لینک زیر مراجعه کنید:

https://gansystems.com/webinar-thermal-management/?utm_source=mailchimp

Web Meeting: attendee.gotowebinar.com/register/8115081216726412301

Webinar ID: 783-710-643

Title: Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates

Presenters: Prof. Doug Hopkins and Tzu-Hsuan Cheng, North Carolina State University

Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as automotive and telecom power. This new substrate approach opens new module configurations for heterogeneous integration of power and signal, along with sensing, and supports the recent advances in small-die-size power WBG devices. This webinar takes a comprehensive approach to introducing components, materials, equipment and processes for working with new laminates, and provides a detailed design approach to double-sided power electronics converter modules.

Date: July 23, 2020

Time:

8:00 A.M. – 9:00 A.M. Pacific

9:00 A.M. – 10:00 A.M. Mountain

10:00 A.M. – 11:00 A.M. Central

11:00 A.M. – 12:00 P.M. Eastern

4:00 P.M. – 5:00 P.M. UK

5:00 P.M. – 6:00 P.M. Central Europe

11:00 P.M. – 12:00 A.M. China/Taiwan

12:00 A.M. – 1:00 A.M. Korea/Japan